CMP Pad is a polishing pad made of polyurethane which adheres to Platen of a CMP apparatus in a CMP (Chemical Mechanical Polishing) process which is an indispensable step according to the refinement of a semiconductor process and performs a polishing action of Slurry and a semiconductor Wafer It is PAD.

CMP PAD contains many Pore, it is divided into Hard and Soft depending on the characteristics and it is three consumables of Slurry, Disk and CMP process.

FNS TECH acquires US "INNO Pad" company in 2013, started a full-scale CMP PAD business, developed a new Pad of recent new technology, and rising rapidly in the sacredness of the CMP Pad industry.