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A device that removes natural oxide fime, ion, organic matters, metal and impurities on substrates by using solutions or DI water.

Polishing pad used in semiconductor CMP

Slim down the thickness of LCD glass with chemical or make OLED ENCAP Glass.

For TOC removal and bacterial sterilization present in DI & WATER, low pressure UV LAMP

Slim down the thickness of LCD glass with chemical or make OLED ENCAP Glass.

A device that removes natural oxide fime, ion, organic matters, metal and impurities on substrates by using solutions or DI water.

Polishing pad used in semiconductor CMP

Slim down the thickness of LCD glass with chemical or make OLED ENCAP Glass.

For TOC removal and bacterial sterilization present in DI & WATER, low pressure UV LAMP

Slim down the thickness of LCD glass with chemical or make OLED ENCAP Glass.