Polishing pad used in semiconductor CMP

- CMP (Chemical Mecanical Polishing), chemical mechanical polishing: While slicing the Slurry with the wafer in contact with the polishing PAD surface, chemically reacting the Wafer surface and moving the Head and Polishing Table relative to each other Technique for mechanically flattening the uneven part of Wafer
- Materials in direct contact with Wafer, generally use Polyurethane.

- CMP Pad

Point of Control
• Polymer Chemistry
- Hardness
- Adrasion Resistance

• Fiber Sizes and Orientation
- Fiber Type
- Fiber Density
- Fiber Size
- Fiber Pattern

• Porosity Control
- Fiber : Polymer Ratio

• Boundary Location
- Porous : Solid Ratio