Equipment that uses Chemical to etch the thickness and shape of Glass
CHARACTERISTICS
1. Ultra-precise thickness control (Nano-Level Thickness Control)
- Uniform etching technology: Maximize substrate flatness through proprietary etchant injection control technology that cuts the entire large-area glass substrate to the same thickness
- Real-time monitoring: Real-time measurement of the etch process to precisely achieve the target thickness desired by the customer in micro-scale
2. Double-sided/one-sided custom etching
- Double-side slimming: simultaneously etched both sides of the substrate to reduce processing time and significantly increase productivity
- Surface Finishing: Smoothly manages the roughness of the glass surface after etching to minimize defect rates and increase transmittance in subsequent processes
3. Large area and thin plate transfer technology (Thin Glass Handling)
- Responding to large substrates: From IT product substrates for TVs and monitors to ultra-thin glass (UTG) responses for foldable substrates
