Equipment to shape fine circuit patterns by selectively removing the part that received (or did not receive) light
ListCHARACTERISTICS
1. Super uniformity control
- High-performance spray system: Spray developer at constant pressure and angle over the entire area of the substrate to control pattern deviations by position
- Remove microbubbles: suppress microbubbles that may occur when spraying the developer to prevent pattern defects and ensure uniform development results
2. Implementation of a Precision Profile
- Precise control of reaction time: Precisely control the time the photosensitive fluid reacts with the developer in seconds to form a vertical and sharp cross-section of the pattern
- Rince: Over-development is prevented and critical dimensions of the circuit are maintained stably through a rinse process that quickly cleans up the residue immediately after development
3. Intelligent liquid management
- Automatic control of liquid concentration and temperature: Maintain the best process conditions by managing the temperature and concentration of the developer that directly affects the development efficiency in real time
4. Large Area and Flexible Response
- Safely transferring and developing technology to 8th generation or larger large-area substrates as well as flexible/foldable thin substrates without damage
