Equipment to remove certain areas of metal film deposited on the substrate using Etchant
Features
Etching Unit
Oscillation Type
Spray Type
Dip Type
CHARACTERISTICS
1. Ultra uniform etch control (Ultra-Uniform Etching)
- Independent nozzle system: Minimize etch deviation by location with high-performance nozzle placement that evenly sprays etchant across the entire substrate area
- High-precision concentration and temperature management: Monitor and control the concentration and temperature of the etchant in real time to ensure consistent etch rate even during prolonged operation
2. Fine pattern implementation technology (Fine Patterning)
- Under-cut minimization: Precisely controlled drug flow and reaction time, optimized for high-resolution panel processes by forming sharp and clean cross sections of the circuit
- Support for a wide range of thin films: Provide customized etching processes optimized for a wide range of materials, including metals (Al, Cu, Mo, etc.) and organic/inorganic thin films
3. Optimizing in-line automation
- By integrating cleaning and stripping processes and logistics automation systems into one, a seamless production line is completed from loading to unloading of substrates
