Equipment to remove natural oxide films, ions, organic matter and metal impurities on the substrate using a cleaning agent or DI on the substrate
ListCHARACTERISTICS
1. Ultra-precise contamination control
- Multi-level cleaning system: Combine various cleaning methods such as Chemical, Brush, High Pressure Jet, and Mechanical to completely remove fine pollutants
- Uniform cleaning performance: Even large-area substrates maintain uniform cleaning quality, from large TVs to ultra-high resolution mobile panels
2. Advanced substrate protection technology
- Thin Glass Response: Implement substrate protection by applying precision pressure control and non-contact transfer technology to prevent damage to increasingly thin high value-added substrates
3. Smart drying and eco-friendly systems
- Spot-free drying: blocking source of residual water marks (water marks) through air knife
- Energy reduction design: Optimized DI water and chemical usage and build recycling system to contribute to cost reduction for customers
4. Large Area and Flexible Response
- Safely transferring and precise cleaning technology to 8th generation large-area substrates as well as flexible/foldable thin substrates without damage
