Equipment to remove fine glass particles, chemical residues, and contaminants inside the via hole generated in the glass substrate process
ListCHARACTERISTICS
1. High aspect ratio cleaning inside the hall
- Ultrasonic and megasonic technology: High frequency vibration energy is utilized to allow cleaning fluids to reach the inside of the fine hole, allowing fine particles to be peeled off inside the hole without damaging the substrate
- Vacuum and pressure variable control: precise control of process pressure to allow cleaning fluids to seamlessly enter and exit narrow and deep via holes
2. Residual sludge and organic matter removal
- Chemical/physical complex cleaning: Completely remove remaining glass sludges and various organic pollutants after laser or etching process using special chemicals and precision brush systems
- Surface activation: Processing the glass substrate surface to the optimum state during the cleaning process to maximize adhesion in subsequent seed layer deposition or plating processes
3. Ultra-thin substrate protection and transfer
- Damage Free Transfer: Equipped with air-floating and low-vibration systems that safely return structurally vulnerable glass substrates with TGV process
- Perfect drying system: Air knife and vacuum drying method designed specifically to prevent moisture from remaining inside the hall for the best drying condition without water marks
