Facilities that form numerous via holes on glass substrates or precisely process the shape of the formed holes
Features
Compatible with hydrofluoric acid and alkali etching
Capable of precise hole formation and high aspect ratio
Enables improved yield and microcircuit implementation
CHARACTERISTICS
1. Ultra fine via hole processing
- Precision shape control: Chemical etching of laser-formed microholes to improve roughness inside the hole and precise processing to desired angles and diameters
- High Aspect Ratio: evenly penetrate etchant into deep and narrow holes to form millions of via holes across the entire substrate without erro
2. Damage-free process
- Micro-Crack Removal: Smooth removal of microcracks or thermal deformation that may occur during laser processing, increasing the mechanical strength of glass substrates and ensuring reliability
- Non-contact uniform etching: Minimize risk of damage to ultra-thin glass substrates by adopting a wet method that does not cause physical stress on the substrate
3. Intelligent drug flow control
- Ultra-fine bubble control: Equipped with a dedicated nozzle and pressure control system that effectively removes bubbles that interfere with etch reactions within fine holes and circulates medications
- Real-time Concentration Management: Real-time analysis of drug components and optimal condition for consistency in etch quality
4. Total solution for glass substrates
- Integrate TGV etching as well as post-war processes such as ultra-precision cleaning and logistics automation into one line to achieve unique process efficiency
