Features
- CMP (Chemical Mecanical Polishing), chemical mechanical polishing: While slicing the Slurry with the wafer in contact with the polishing PAD surface, chemically reacting the Wafer surface and moving the Head and Polishing Table relative to each other Technique for mechanically flattening the uneven part of Wafer
- Materials in direct contact with Wafer, generally use Polyurethane.